A Package Construction Overview of the Cambridge Silicon Radio Bluecore 5 Multimedia External (BC57E687B) Bluetooth RFIC

This Package Construction Overview of the Cambridge Silicon Radio Bluecore 5 Multimedia External (BC57E687B) Bluetooth RFIC provides an overview of package design and structure including:

- Package cross section and SEM imaging
- Identification of key material in solder and metallization with SEM/EDS
- Analysis of package construction to determine if shielding is present
- Pin/ball count
- Measurement of pin/ball size and pitch
- Substrate and metallization layer thickness
- Identification of bonding/bumping technique and materials.
- Oblique-angle photo of one end of the substrate window