Functional Layout II including options of the STMicroelectronics STN8815 Mobile Applications Processor

The following report contains an analysis of the embedded memories, die utilization and minimum dimensions for this device. Included in this analysis is an SEM cross section to illustrate the minimum feature size as well as photographs of the package, die and die markings. Die utilization information is provided in tables and charts showing the identities and sizes of the functional areas along with an annotated die photograph illustrating the location of these functional blocks. Logical and physical sizes are provided for the embedded memories and an SEM topographical image of each embedded memory cell type is included. Also included is a topographical SEM image of a NAND gate annotated with dimensions. The minimum device dimensions include minimum widths and pitches for all metal levels as well as SEM images illustrating these dimensions.

This report also comes with 30 minutes of analyst time that is to be used within 6 months of the report's purchase