CircuitVision Analysis of the Memory Array and Peripherals on the Toshiba TC58NVG4D2ETA00 43nm 16Gbit MLC NAND Flash

The CircuitVision Analysis of the Memory Array and Peripherals looks at the key elements of the NAND Flash design. The report will investigate the innovations in the memory array and peripherals. The report will include schematics and layout information for the page buffers, and row decoders along with circuitry for WL switches. The report also includes general information about the die and package. Specifically the work includes deliverables such as:

Architectural Overview
The Architectural Overview section contains general information concerning the package and die. This section includes deliverables such as:
- Package Photographs (Top and Bottom)
- Package X-Ray
- Die Photograph
- Die Map (Physical location of circuit elements)
- Array Information
1. Dimensions
2. Wordline Structure
3. Bitline Structure

Memory Array and Peripherals
The work will cover circuit extraction, analysis and organization of the memory array and page buffer area. It includes deliverables such as:
- Annotated topographical images of page buffers and array peripheral circuitry
- Page Buffers and related circuitry
- Row Decoders and related circuitry
- WL Switches and related circuitry
- Memory Arrays