Logic Detailed Structural Analysis including Process Flow on the Intel 45nm QX9650 Penryn Processor (Engineering Sample)

UBM TechInsights’ Logic Detailed Structural Analysis (LDSA) report provides comprehensive analysis of the process technology and design rules used for standard cell logic and embedded memory of a particular ASIC, microcontroller or processor. The analysis is based on SEM, TEM, EDS, X-ray, SRP techniques and comprises: device overview (package, annotated die, die markings, bond pads, die corners, edge seal); general process, standard cell logic and embedded memory cell analyses.

General Process Analysis delivers a characterization of die levels from substrate to passivation, including FEOL and BEOL with critical dimensions by SEM/TEM/SRP and materials identification by TEM EDS. Optional analytical methods (e.g. SIMS, SCM) may be used, if necessary. Special attention is given to core logic transistors and I/O transistors that may have a metal or polycide gate, a high-k gate dielectric, sophisticated gate sidewall structure and other important features. Layout of circuitry under bond pads, dummy STI and metal patterns, fuses, inductors, resistors and other elements (if applicable) are provided.

Analysis of standard cell logic and embedded memory cell includes layer-by-layer SEM topographical imaging at different levels from gate to metal. SEM and TEM cross-sections of logic and memory regions provide detail information on logic and memory transistors, including critical dimensions (memory cell, gates, contacts, capacitors, etc.) and material identification (silicide layers, inter-poly dielectrics, capacitor electrodes, capacitor dielectrics, etc.). All key innovative features used for a particular device are highlighted in the Major Findings and Executive Summary of the report.

LDSA reports help managers, engineers and researchers to:
• track key innovations used for a logic IC (critical dimensions and design rules, new materials and modified structures, etc.);
• increase market share by penetrating market faster with appropriate products;
• reduce the risk of investments in new processes and equipment;
• reduce process development expenditures;
• support informed decision making on where to invest and which technical resources to invest in; and
• support IP campaigns with valuable “Evidence of Use” information of various process features.

This analysis includes process flow information.